Samsung Electronics Co., Ltd. of Seoul, South Korea, has introduced the Fx-CSP, a line-up of LED packages. The Fx-CSP line features chip-scale packaging and flexible circuit board technology. The new LEDs are for use in automotive lighting applications.
“Our new Fx-CSP line-up will bring greater design flexibility and cost competitiveness to the automotive lighting industry,” said Jacob Tarn, executive vice president, LED Business Team, Samsung Electronics. He added, “We will continue to introduce innovative LED products and technologies, such as multi-chip array technology, that can play a key role in the growth of the automotive LED lighting industry.”
Samsung says its new line combines chip-scale packaging and flexible circuit board technology for a more compact chip that is more reliable. The flexible circuit board enables more heat dissipation, which leads to lower resistance and a higher lumen-per-watt efficiency compared to a ceramic board. The new Samsung automotive LED line also allows car designers to employ a variety of chip arrangements including a single chip, a 1 by 4, or a 2 by 6 multi-chip arrangement to suit different lighting configurations. Automotive lighting applications including position lamps and daytime running lamps and headlamps that need superior luminous flux and reliability compared to other automotive lamps can use the Fx-CSP line.
The Fx-CSP line-up consists of single packages, Fx1M and Fx1L, with 1-3 watts each and packages with a 14W high voltage array, Fx4 and a 40W high voltage array, Fx2x6. The wattage variation allows the new Samsung LED packages to work with a broad range of exterior automotive lights. Samsung says that adding the new Fx-CSP line-up to its existing mid-power and high-power automotive LED component lines enables the company to provide a highly competitive family of automotive lighting components.
According to Samsung, a major global automotive manufacturer recently selected Samsung’s new Fx-CSP LED line for a compact car headlamp project.