Genesis Photonics Inc. of Taiwan has been promoting FC CSP (flip-chip chip scale packaging) for automotive headlights, according to an article in Digitimes. The company hopes that the promotional efforts will help it again become profitable after eight consecutive quarters of net losses.
According to the article, Genesis has supplied FC CSP automotive headlight modules to Taiwan-based automotive lamp makers for after-market sale. The company has also begun small-volume shipments to a US-based truck headlight maker. In addition, in the first half of 2017, Genesis plans to begin shipping LED headlight modules to China-based automotive lamp producers for after-market sale and then to OEMs in the second half of 2017.
Furthermore, Genesis has developed FC CSP flash modules for vendors of smartphone flashes and intends to begin shipping the flash modules in the first quarter of 2017.
To lower production costs, Genesis has upgraded its MOCVD systems from 2-inch LED wafers to 4-inch. Also, in a plan to reduce operating costs, Genesis intends to sell a factory in Kunshan, eastern China, due to very low capacity utilization.